6621 Fleetwood Drive
Suite 113 - 117
Raleigh, NC 27612 USA
Phone (919) 789-0777 www.udmsystems.com
PRODUCT DESCRIPTION
UDM-L001 series is a nonionic concentrated wafer
dicing and ingot slicing coolant/lubricant
specifically formulated for processing Semiconductor
and Medical materials. UDM- L series products
are uniquely formulated with high performance
dispersants and wetting agents to reduce
water surface tension and eliminate wafer
surface contamination during wafer dicing
and wafer scrub. It
is highly effective for die separating small
delicate devices especially in cases where
wafer surface contamination with swarf or
sawdust is critical issue. UDM-L is biodegradable
and environmentally friendly.
UNIQUE FEATURES
Increase heat transfer and reduce thermal stress
Effectively reduces the surface tension of water
Outstanding wetting properties and excellent rinseability
Enhance wafer cut quality
Increases die yield and reliability, and reduces ESD
Sodium and Potassium free material
Extend Blade life by 20-30%
Odor free
Biodegradable, non-hazardous and hence easily disposable
PHYSICAL PROPERTIES
Appearance Specific Gravity at 20/20° C
Slightly cloudy white liquid
1.069
Density at 25° C, Ib/gal
Viscosity at 25° C, centipoise (cP)
Flash Point, Tag Open Cup, ° C
8.5
3.5
N/A
Pour Point, ASTMD, ° C
pH of solution
N/A
7.05
WETTING PROPERTIES
UDM- L series is completely soluble in water and is an excellent wetting
agent with low foam. Its ability to wet semiconductor substrates rapidly is a key performance property in
both dicing and wafer cleaning applications.
UDM- L series was found to have faster wetting times than the other brands of lubricants because
of its excellent surface activities.
SURFACE TENSION PROPERTIES
Water surface tension decreases with increase in the lubricants concentration until
the critical micelle concentration is reached. At about ~29.0 mN/m (Minimum 200:1
dilution ratio) the surface tension of the dilute water solution is about
the same as the lubricant concentrate and therefore is optimal for semiconductor
wafer dicing or cleaning.
