Surface Cleaning Agents - FLC200 Series
UDM Systems FLC200 Cleaning Solution concentrate is specially formulated aqueous concentrate designed to dissolve and remove the most difficult, baked-on, oily fluxes and residues left on parts after the soldering process. A unique and efficient product, the UDM Electronic Cleaner removes oxides and contaminants, solder flux residue from printed circuit boards (PCB) after the surface mount technology (SMT) process.
UDM Systems FLC200 cleaner’s low surface tension and excellent wetting properties allows for penetration of isolated and tight-tolerance areas to quickly remove non-ionic and ionic contaminants left on circuit boards.
UDM Systems FLC200 Cleaning Solution concentrate is safe to use due to the following properties: nonabrasive, non-toxic, non-flammable, and fully water soluble. The FLC200 is completely biodegradable and environmentally friendly, thus eliminating the need for special handling or disposal.