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Wafer Dicing Lubricants

Our L300 Series Dicing Lubricants are ideal for enhancing die-separation process to maximize yields and improve customer profitability.
L300 Series lubricants are specifically designed to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion, cleaner bonding pads, and prevent galvanic corrosion.

Products

UDM L300 D5 Semiconductor Dicing Lubricant

Wafer Dicing Lubricant - L300 D5
Reduction of both electrostatic build up and sawdust surface contamination are essential in today's die separation of ultra-thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors). The UDM Systems® L-Series lubricants are specifically designed to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.
  • L Series lubricants are biodegradable, non-corrosive aqueous solution
  • Completely water-soluble
  • For optimum dicing results, ratio of de-ionized water (DI): L300-01-D5 Series should be between 1000:1 and 1500:1

Unique Features

  • Increase heat transfer and reduce thermal stress
  • Effectively reduces the surface tension of water
  • Outstanding wetting properties and excellent rinseability
  • Enhance wafer cut quality
  • Increases die yield and reliability, and reduces ESD
  • Sodium and Potassium free material
  • Extend Blade life by 20% to 30%
  • Very mild odor
  • Biodegradable, non-hazardous and hence easily disposable

UDM L300 D5CMOS Semiconductor Dicing Lubricant

Wafer Dicing Lubricant - L300 D5CMOS
Reduction of both electrostatic build up and sawdust surface contamination are essential in today's die separation of ultra-thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors).

The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.
  • L-Series lubricants are biodegradable, non-corrosive aqueous solution
  • Completely water-soluble
  • For optimum dicing results, ratio of deionized water (DI):
  • L300-01-D5CMOS Series should be between 1000:1 and 1500:1

Unique Features

  • Increase heat transfer and reduce thermal stress
  • Effectively reduces the surface tension of water
  • Outstanding wetting properties and excellent rinseability
  • Enhance wafer cut quality
  • Increases die yield and reliability, and reduces ESD
  • Sodium and Potassium free material
  • Extend Blade life by 20% to 30%
  • Very mild odor
  • Biodegradable, non-hazardous and hence easily disposable

UDM L300 N2000 Semiconductor Dicing Lubricant

Wafer Dicing Lubricant - L300 N2000
Reduction of both electrostatic build up and sawdust surface contamination are essential in today's die separation of ultra-thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors).

The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.
  • L Series lubricants are biodegradable, non-corrosive aqueous solution
  • Completely water-soluble
  • For optimum dicing results, ratio of de-ionized
  • Water (DI): L300-01-00 (N2000) Series should be between 2000:1 and 3000:1

Unique Features

  • Increase heat transfer and reduce thermal stress
  • Effectively reduces the surface tension of water
  • Outstanding wetting properties and excellent rinseability
  • Enhance wafer cut quality
  • Increases die yield and reliability, and reduces ESD
  • Sodium and Potassium free material
  • Extend blade life by 20% to 30%
  • Very mild odor
  • Biodegradable, non-hazardous and hence easily disposable

UDM L300 N2000_B Semiconductor Dicing Lubricant

Wafer Dicing Lubricant - L300 N2000B
For advanced applications, UDM provides the N2000_B, which offers the same superior features and performance of the N2000 but with a higher concentration.

The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.
  • L Series lubricants are biodegradable, non corrosive aqueous solution
  • Completely water-soluble
  • For optimum dicing results, ratio of de-ionized
  • Water (DI): L300-01-00 (N2000_B) Series should be between 5000:1 and 6000:1

Unique Features

  • Increase heat transfer and reduce thermal stress
  • Effectively reduces the surface tension of water
  • Outstanding wetting properties and excellent rinseability
  • Enhance wafer cut quality
  • Increases die yield and reliability, and reduces ESD
  • Sodium and Potassium free material
  • Extend blade life by 20% to 30%
  • Very mild odor
  • Biodegradable, non-hazardous and hence easily disposable


L-Series Advantages
Semiconductor Brochure

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6621 Fleetwood Drive Raleigh, NC 27612
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