Products
UDM L300 D5 Semiconductor Dicing Lubricant
Reduction of both electrostatic build up and sawdust surface contamination are essential in today's die separation of ultra-thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors). The UDM Systems® L-Series lubricants are specifically designed to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.
- L Series lubricants are biodegradable, non-corrosive aqueous solution
- Completely water-soluble
- For optimum dicing results, ratio of de-ionized water (DI): L300-01-D5 Series should be between 1000:1 and 1500:1
Unique Features
- Increase heat transfer and reduce thermal stress
- Effectively reduces the surface tension of water
- Outstanding wetting properties and excellent rinseability
- Enhance wafer cut quality
- Increases die yield and reliability, and reduces ESD
- Sodium and Potassium free material
- Extend Blade life by 20% to 30%
- Very mild odor
- Biodegradable, non-hazardous and hence easily disposable
UDM L300 D5CMOS Semiconductor Dicing Lubricant
Reduction of both electrostatic build up and sawdust surface contamination are essential in today's die separation of ultra-thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors).
The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.
The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.
- L-Series lubricants are biodegradable, non-corrosive aqueous solution
- Completely water-soluble
- For optimum dicing results, ratio of deionized water (DI): L300-01-D5CMOS Series should be between 1000:1 and 1500:1
Unique Features
- Increase heat transfer and reduce thermal stress
- Effectively reduces the surface tension of water
- Outstanding wetting properties and excellent rinseability
- Enhance wafer cut quality
- Increases die yield and reliability, and reduces ESD
- Sodium and Potassium free material
- Extend Blade life by 20% to 30%
- Very mild odor
- Biodegradable, non-hazardous and hence easily disposable
UDM L300 N2000 Semiconductor Dicing Lubricant
Reduction of both electrostatic build up and sawdust surface contamination are essential in today's die separation of ultra-thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors).
The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.
The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.
- L Series lubricants are biodegradable, non-corrosive aqueous solution
- Completely water-soluble
- For optimum dicing results, ratio of de-ionized
- Water (DI): L300-01-00 (N2000) Series should be between 2000:1 and 3000:1
Unique Features
- Increase heat transfer and reduce thermal stress
- Effectively reduces the surface tension of water
- Outstanding wetting properties and excellent rinseability
- Enhance wafer cut quality
- Increases die yield and reliability, and reduces ESD
- Sodium and Potassium free material
- Extend blade life by 20% to 30%
- Very mild odor
- Biodegradable, non-hazardous and hence easily disposable
UDM L300 N2000_B Semiconductor Dicing Lubricant
For advanced applications, UDM provides the N2000_B, which offers the same superior features and performance of the N2000 but with a higher concentration.
The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.
The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.
- L Series lubricants are biodegradable, non corrosive aqueous solution
- Completely water-soluble
- For optimum dicing results, ratio of de-ionized
- Water (DI): L300-01-00 (N2000_B) Series should be between 5000:1 and 6000:1
Unique Features
- Increase heat transfer and reduce thermal stress
- Effectively reduces the surface tension of water
- Outstanding wetting properties and excellent rinseability
- Enhance wafer cut quality
- Increases die yield and reliability, and reduces ESD
- Sodium and Potassium free material
- Extend blade life by 20% to 30%
- Very mild odor
- Biodegradable, non-hazardous and hence easily disposable
