UDM Systems®
provides wafer dicing and surface cleaning
technologies to semiconductor, optoelectronics,
thin film head and biomedical industries.
Products include dicing lubricants,
precision cleaning solutions and fluid
dispensing systems.
Today, with increased adoption of RFID
tags, smart cards, and SIP (system in
package) for cellular phones and other
mobile products, the demand and the
market for ultra-thin semiconductor
devices has increased dramatically. |
