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6621 Fleetwood Drive
Suite 113 - 117
Raleigh, NC 27612 USA
Phone (919) 789-0777
www.udmsystems.com
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Semiconductor Dicing Lubricants
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UDM L SERIES LUBRICANT/COOLANT & CLEANERS IMPROVES DIE YIELD AND SAVES COST
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UDM- L series is a nonionic concentrated wafer dicing and ingot slicing coolant/lubricant specifically formulated
for processing Semiconductor and Medical materials. UDM- L series products are uniquely formulated with high
performance dispersants and wetting agents to reduce water surface tension and eliminate wafer surface
contamination during wafer dicing and wafer scrub.
Highly effective for die separating small delicate devices
Eliminate wafer surface contamination and ESD issues - Swarf or sawdust
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Unique Features
- Increased heat transfer and reduced thermal stress
- Effectively reduces the surface tension of water
- Outstanding wetting properties and excellent rinseability
- Increases die yield and reliability, and reduces ESD
- Extends Blade life by 20-30%
- Odor free
- Biodegradable, non-hazardous and easily disposable
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Applications for L Series Coolant/Lubricant
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Wafer Dicing @ 65-72 deg F
DI Water: L Series ratio
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Wafer Slicing @ 65-72 deg F
DI Water: L Series ratio
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Wafer Back Grinding @ 65-72 deg F
DI Water: L Series ratio
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Si, GaAs, InP, Silicon Germanium, Ceramics
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200:1 - 1500:1
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500:1 - 2000:1
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500:1 - 2000:1
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SiC, Sapphire, Ferrite materials, Alumina, Glass
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200:1 - 1500:1
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500:1 - 2000:1
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500:1 - 2000:1
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