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  Advantages
  Semiconductor Dicing Lubricants
   
UDM L200
UDM L300
UDM L400
  Lubricant Dispensing systems
  MSDS
   
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6621 Fleetwood Drive
Suite 113 - 117
Raleigh, NC 27612 USA
Phone (919) 789-0777
www.udmsystems.com
 
L Series Lubricants-Wafer Dicing

UDM® L series lubricants represent the best technologies for your wafer dicing. Whether you are dicing Silicon, GaAs, Silicon Carbide, Sapphire or any other semiconductor, optoelectronics or Biomedical material, the L series lubricants is the essential for your die separation application.

L Series Wafer Surface Cleaners
UDM Systems® , LLC® L Series Cleaning solution provide the performance and the capabilities needed for processing wafers with various technologies, which includes 90 nm, 65 nm and the upcoming 45 nm technology node.
LD Series Lubricant Dispensing Systems
Get enhanced performance, features, and capabilities from UDM Systems® , LLC® LD series lubricant dispensing systems. The UDM Systems® , LLC® LD series is designed with computerized digital capabilities to deliver precisely the set up mixing ratio for optimum results.