UDM Systems

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Semiconductor Dicing Lubricants

	UDM L100
	UDM L200
	UDM L300
	UDM L400

Lubricant Dispensing systems

MSDS

	UDM-L300 series
	UDM-Lseries

8311 Brier Creek Parkway Suite 105-159
Raleigh, NC 27617 USA Phone (336)543-8040
www.udmsystems.com

Semiconductor Dicing Lubricants

Part#s
	UDM L200 -001-01(1 Gallon) UDM L200 -001-05 (5 Gallon Pail) UDM L200 -001-55 (55 Gallon Drum)
Description - Coolant / Lubricant solution for wafer slicing, dicing and scrubbing. Solution is specifically design for high volume wafer dicing to enable heat dissipation and reduction in sawdust surface contamination.

Part#s
	UDM L300 -001-01(1 Gallon) UDM L300 -001-05 (5 Gallon Pail) UDM L300 -001-55 (55 Gallon Drum)
Description - Coolant / Lubricant solution for wafer slicing and dicing and also for mask and wafer scrubbing. This Biodegradable and non corrosive aqueous solution is ideal for reducing electrostatic buildup and enhance lubrication enabling sawdust dispersion and cleaner bonding pads.

Part#s
	UDM L100 -001-01(1 Gallon) UDM L100 -001-05 (5 Gallon Pail) UDM L100 -001-55 (55 Gallon Drum)
Description - Low foaming to non foaming coolant/ lubricant concentrate for dicing very delicate or precision Silicon products

Part#s
	UDM L400 -001-01(1 Gallon) UDM L400 -001-05 (5 Gallon Pail) UDM L400 -001-55 (55 Gallon Drum)
Description - Mini foaming non corrosive coolant/ lubricant concentrate for dicing hard brittle thin film head materials for storage applications

Lubricant Injectors or Lubricant Dispensing systems

1 line systems will dispense coolant/lubricant to 1
2 line systems will dispense coolant/lubricant to 2 saws at the same time
3 line systems will dispense coolant/lubricant to 3 saws at the same time

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