Surface Tension Reduction: UDM-L used as an additive to the de-ionized water reduces the water surface tension from 70 dynes /cm to 29.0 dynes / cm And thus allow cooling water to penetrate down in the kerf. (The higher surface tension the harder it is for cooling water to penetrate down in the Kerf.)

Heat Transfer: UDM-L optimizes dicing process by dissipating heat and reducing friction at the contact zone (contact point of the dicing blade and work piece)

Sawdust Dispersion: Improperly cooled dicing wheel will “load up” with debris and thus reduces the wear rate of the blade and prevent the exposure of fresh diamonds needed for cutting. UDM-L disperses the swarf particles (sawdust dust) generated during dicing there by preventing the compaction of swarf, which is main cause of chipping and die wall micro cracks.

Extends blade life: A dicing wheel cooled with UDM-L treated water increases blade life by about 20- 40 %. The wheel will run cooler with much less drag and will be less susceptible to metal fatigue. UDM-L effectively frees the working edge of swarf (sawdust). Sawdust will not abrade the sides of the dicing wheel hence the blade will last much longer.

ESD (electrostatic discharge) Reduction: Dicing with UDM-L treated DI water reduces ESD with out increasing the acidity of the cooling DI water. Static charges cause swarf (silicon dusts) to adhere to wafer surface, thus causing bonding and contamination problems. Dicing with UDM-L treated DI water reduces or completely eliminates ESD and therefore prevents wafer surface contamination and improves bonding pad integrity and die reliability.

Improve Wafer and die reliability: Wafer and Die reliability is significantly improved with use of UMD-L. Chipping, micro- cracking, cleaner bonding pads and die yield are all improved. This increase in die yield will more than justify the cost of UMD-L.

Is UDM-L Safe? UDM-L is completely safe for all types of materials including Silicon, Piezo, Lithium Niobate, Lithium Tantalite, Gallium Arsenide (GaAs), Silicon Germanium, Sapphire and Glass etc