UDM Systems® offers conductive and non-conductive adhesives that can be used to secure semiconductor wafers for polishing, dicing, or other mechanical processing. Our adhesives are provided in the desired thickness on release paper. Typical applications include semiconductor wafer dicing, semiconductor wafer sawing, and lapping and polishing.

UDM Systems® provides custom thicknesses and release paper sizes. Common thicknesses range between 1 and 3 mils. Release pager sizes range from 2 inch X 2 inch to 5 inch X 5 inch. Rectangular sizes are also available. Contact UDM Systems® for your special thickness and size requirements.