 UDM
Systems® provides wafer dicing
and surface cleaning technologies to semiconductor,
optoelectronics, thin film head and biomedical
industries. Products include dicing lubricants,
precision cleaning solutions and fluid dispensing
systems.
Today, with increased adoption of
RFID tags, smart cards, and SIP
(system in package) for cellular phones
and other mobile products, the market for
ultra-thin semiconductor devices has increased
dramatically. Thinner packages and 3-D or
stacked devices in a package have further
pushed devices down into 50 to 100 µm
thickness range. To meet these needs and
the processing results that the device manufactures
require, UDM Systems®
continuously researches and develops die
separation products and applications to
enable easy manufacturing of these complex
devices.
UDM Systems®
is committed to providing our customers
unequaled value both in products we manufacture
and services we offer.
UDM Systems®
is dedicated to providing you with products
and technical support services on die separation,
wafer back-grinding and surface cleaning
applications. Our Main objective is to help
you deliver superior defect free products
to your customers at an economical cost
so as to maximize profits.
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