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UDM Systems Lubricant Bottle L300-01
6621 Fleetwood Drive
Suite 113 - 117
Raleigh, NC 27612 USA
Phone (919) 789-0777
www.udmsystems.com
UDM Systems L300-01 Dicing Lubricant
  Reduction of both electrostatic buildup and sawdust surface contamination are essential in today's die separation of ultra thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors). The L series lubricants are specifically designed to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads. L Series lubricants are biodegradable, noncorrosive aqueous solutions and are completely water soluble.
  UDM Systems® - L300 Series cleaning solution provide the performance and the capabilities needed for processing wafers with various technologies, which includes 90 nm, 65 nm and the upcoming 45 nm technology node. UDM- L series products are specifically formulated with high performance dispersants and wetting agents to reduce water surface tension and eliminate wafer surface ionic contamination.
Highly effective for die separating delicate III-V materials devices.
Excellent for eliminating wafer surface ionic contamination.
 
  Unique Features
 
  • Effectively reduces the surface tension of water
  • Outstanding wetting properties and excellent rinseability
  • Increases die yield and reliability
  • Odor free
  • Biodegradable, non-hazardous and hence easily disposable
 
  Applications for L300 Series Cleaning solutions
 
Wafer Dicing @ 65-72 deg F
DI Water: L Series ratio
Mask & Wafer Scrubbing @ 65-72 deg F
DI Water: L Series ratio
Si, GaAs, InP, Silicon Germanium, Ceramics 200:1 - 1500:1 200:1 - 1500:1
SiC, Sapphire, Ferrite materials, Alumina, Glass 200:1 - 1500:1 200:1 - 1500:1
UDM Systems Lubricant Label L300-01
Description - L300 Coolant / Lubricant applications include wafer slicing and dicing, and mask and wafer scrubbing. This biodegradable and non corrosive aqueous solution is ideal for reducing electrostatic buildup and enhancing lubrication enabling sawdust dispersion therefore yielding cleaner bonding pads.
Part#s
UDM L300-01-01 N2000 (1 Gallon)
UDM L300-01-05 N2000 (5 Gallon Pail)
UDM L300-01-55 N2000 (55 Gallon Drum)
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