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6621 Fleetwood Drive
Suite 113 - 117
Raleigh, NC 27612 USA
Phone (919) 789-0777
www.udmsystems.com
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UDM Systems L300-01-D5 Dicing Lubricant
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Reduction of both electrostatic buildup and sawdust surface contamination are essential in today's die
separation of ultra thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors).
The L series lubricants are specifically designed to reduce electrostatic buildup, enhance lubrication,
enabling sawdust dispersion and cleaner bonding pads. L Series lubricants are biodegradable, noncorrosive
aqueous solutions and are completely water soluble.
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Description - L300-D5 Coolant / Lubricant applications include wafer
slicing and dicing, and mask and wafer scrubbing. This biodegradable and non-corrosive aqueous solution
is ideal for reducing electrostatic buildup and enhancing lubrication enabling sawdust dispersion
therefore yielding cleaner bonding pads.
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UDM L300-01-D5-01(1 Gallon)
UDM L300-01-D5-05 (5 Gallon Pail)
UDM L300-01-D5-55 (55 Gallon Drum)
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