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6621 Fleetwood Drive
Suite 113 - 117
Raleigh, NC 27612 USA
Phone (919) 789-0777
www.udmsystems.com
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UDM Systems L200-01 Dicing Lubricant
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Reduction of both electrostatic buildup and sawdust surface contamination are essential in today's die
separation of ultra thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors).
The L series lubricants are specifically designed to reduce electrostatic buildup, enhance lubrication,
enabling sawdust dispersion and cleaner bonding pads. L Series lubricants are biodegradable, noncorrosive
aqueous solutions and are completely water soluble.
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Description - L200 Coolant / Lubricant applications include wafer slicing, dicing and scrubbing. L200 is specifically
designed for high volume wafer dicing to enable heat dissipation and reduction in sawdust surface contamination.
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UDM L200C-01-01 QFN (1 Gallon)
UDM L200C-01-05 QFN (5 Gallon Pail)
UDM L200C-01-55 QFN (55 Gallon Drum)
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